Assignment 1

Intel is fabricating microchips and requires ultra-pure gold connectors deposited onto silicon wafers. This is achieved through electroplating. A new, more complex wafer design is not plating uniformly. a) Describe the fundamental setup of an electrolytic cell used for gold electroplating, identifying the anode, cathode, and electrolyte. Write the electrode reactions. b) Analyze the problem of non-uniform deposition. Using Faraday's laws, explain how variations in current density across the wafer's complex surface could lead to this issue. c) Propose two electrochemical strategies to achieve a more uniform and adherent gold layer. Indian Oil Corporation Ltd. has discovered significant corrosion in its underground mild steel pipeline in a coastal region. Initial reports suggest galvanic corrosion. a) Explain the electrochemical mechanism of galvanic corrosion, identifying the anodic and cathodic areas on the steel pipe and the likely redox reactions in a moist, salty (electrolyte-rich) environment. b) Propose and explain a cathodic protection method to halt the corrosion. Use a schematic diagram to illustrate your proposed system, showing the flow of electrons and ions. c) Justify why this electrochemical protection method is more sustainable and cost-effective in the long run compared to simply replacing the pipe.

Assignment/Case study

https://docs.google.com/document/d/1QgD-VSzIEEbVzqN8LV0kiUWpzERy6pUU/edit?usp=drive_link&ouid=117466778830533385853&rtpof=true&sd=true